led lighting ic LC5205S sanken electric co.,ltd. 1 / 8 1 3 october 2011 description lc5205 s is non - isolated type driver ic for led lighting which can achieve high efficiency in simple circuitry. its compact package which includes output mosfet and control ler, and low external components are suitable for small lighting equipment which requires saving space, like led light bulb. its high voltage capability allows direct connection to rectified ac supply. p rotection features ensure safety led drive. packag e package: so p 8 ? led lighting equipment ? led light bulb main specification mosfet 450 v (min) , 6.0 (max) output current 0.5a (max) main supply voltage 4 50 v ( m ax ) features ? so p8 package o utput mosfet and controller are included in one package. ? high voltage supply input able to d irect connect ion to rectified ac supply . ? built - in constant current controller - pwm mode c urrent control circuitry. - adjustable o utput current by input voltage to ref pin. ? external pwm - pwm signal input to pwm pin enables dimming . - l ow signal shuts off output current . ? under voltage lockout protection (uvlo) p revents malfunction when supply voltage is low. ? over current protection (ocp) l atched in response to the load shor t condition . ? th ermal shutdown protection (tsd) p rotects ic from damage due to excess temperature, auto - restart when temperature drops below threshold typical application circuit http://www.sanken - ele.co.jp l c 5 2 0 5 v b b o u t s e n g n d r e g p w m r e f r 1 r 2 r o f f c o f f c 2 r s l e d d i c o l l i n e f i l t e r i n p u t c 1 f u s e
led lighting ic LC5205S sanken electric co.,ltd. 2 / 8 1 3 october 2011 1 scope the present specifications shall apply to a led driver ic for led lighting, lc5205 s . 2 outline type hybrid integrated circuit structure plastic molded (transfer mold) applications led lighting 3 absolute maximum ratings ( ta=25 ) parameter termina l symbol ratings units remarks main power supply voltage 6 ? 8 v bb 450 v output mosfet breakdown voltag e 5 ? 4 vo 450 v output current 5 ? 4 i o 0.5 1 a exclude t w <1 s ref input voltage 3 ? 8 v ref ? 0.3 v reg +0.3 v sense voltage 4 ? 8 v sen - 0.3 4 v exclude t w <1 s allowable power dissipation D p d 0.85 2 w mounted on pw b 3 junction temperature D t j 150 operating temperature range D t a ? 40 105 storage temperature range D t stg ? 40 150 1 output current rating may be limited by duty cycle, ambient temperature, and heat sinking. under any set of conditions, do not exceed the specified junction temperature (t j ). 2 allowable power dissipation depends on pwb pattern layout. 3 mounted on sanken e val uation b oard .
led lighting ic LC5205S sanken electric co.,ltd. 3 / 8 1 3 october 2011 4 electrical characteristic (ta=25c, v bb =140v, unless otherwise noted.) parameter termina l symbol ratings units remarks m in t yp m ax main power supply current 6 ? 8 i bb D 2 D ma at enable 6 ? 8 i bbs D 0.8 1.2 m a at disable drain - source breakdown voltage 5 ? 4 v ds(br) 450 D D v i d =1ma output mos - fet on resistance 5 ? 4 r ds(on) D 3.5 6.0 i d =0.5a body diode forward voltage 4 ? 5 v f D 0.8 D v i f =0.5a reg output voltage 1 ? 8 v reg 11.5 12 12.5 v i reg =0.1ma reg maximum output current 1 ? 8 i reg D D 2 ma maximum pwm frequency 2 ? 8 f clk 200 4 D D khz duty=50% ref input voltage range 3 ? 8 v ref 0 D 1 v ref input current 3 ? 8 i ref D 10 D a sense input voltage 4 ? 8 v sen v ref ? 30 v ref v ref +30 mv sense input current 4 ? 8 i sen D 10 D a over current protect voltage 4 ? 8 v ocp D 3 D v under v oltage lock out threshold (turn on) 6 ? 8 v uvloon D 14 D v under v oltage lock out threshold (turn off) 6 ? 8 v uvlooff D 13 D v thermal shutdown threshold D t tsd D 150 D c temperature of control ic thermal shutdown hysteresis D t tsdhy s D 55 D c blanking time D t blk D 400 D ns switching time 5 ? 4 t r D 20 D ns io=0.4a 5 ? 4 t f D 50 D ns io=0.4a 4 operation at a pwm frequency greater than 200khz is possible but not warranted.
led lighting ic LC5205S sanken electric co.,ltd. 4 / 8 1 3 october 2011 thermal d ata power dissipation versus ambient temperature 0 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 temperature rise t[ ] total power dissipation p d [w] 0 0.2 0.4 0.6 0.8 1 0 25 50 75 100 125 150 allowable package power dissipation p d [ w ] ambient temperature t a [ ] p d 0.85w
led lighting ic LC5205S sanken electric co.,ltd. 5 / 8 1 3 october 2011 5 functional block diagram ( pin assignment) pin assignment number name function 1 reg 12v internal r egulator output pin 2 pwm connect to pwm off - time setting c&r 3 ref reference voltage for pwm control 4 sen output - current detection pin 5 out output pin 6 out output pin 7 vbb supply voltage pin 8 gnd device ground pin. g a t e d r i v e r l o g i c c u r r e n t c o n t r o l r e g u l a t o r u v l o t s d v b b o u t s e n g n d r e g p w m r e f m i c o c p
led lighting ic LC5205S sanken electric co.,ltd. 6 / 8 1 3 october 2011 6 package 6.1 package drawing and material ? so p8 package material of terminal: cu terminal treatment: sn - ag planting (pb free) 6.2 appearance the body shall be clean and shall not bear any stain, rust or flaw. 6.3 marking the type number and lot number shall be clearly marked by laser so that cannot be erased easily. marking position contents indication lc52 0 5 dimensions in mm
led lighting ic LC5205S sanken electric co.,ltd. 7 / 8 1 3 october 2011 7 cautions and warnings since reliability can be affected adversely by improper storage environment and handling methods during characteristic tests, please observe the following cautions. 7.1 cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 35 ) and the standard relative humidity (around 40 to 75%) and avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust in leads and solderability that have been stored for a long time. 7.2 cautions for characteristic tests and handling ? when characteristic tests are carried out during inspection testing and other standard tests periods, protect the devices from surge of power from the t esting device, shorts between the devices and the heatsink. 7.3 considerations to protect the products from electrostatic discharge ? when handling the devices, operator must be grounded. grounded wrist straps be worn and should have at least 1m of resistance n ear operators to ground to prevent shock hazard. ? workbenches where the devices are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should also be grounded . ? when soldering the devices, the head of a soldering iron or a solder bath must be grounded in other to prevent leak voltage generated by them from being applied to the devices. ? t he devices should always be stored and transported in our shipping container s or conductive containers, or be wrapped up in aluminum foil. 7.4 insulation distance between pins ? the insulation distance between pins is not considered for this product. therefore, please take measures for the insulation distance to apply to user's design standard. 7.5 flow soldering (wave soldering) ? wave soldering (immerse the ic bodies in molten solder) may cause package crack since thermal shock is high, therefore wave soldering is not applicable. ?
led lighting ic LC5205S sanken electric co.,ltd. 8 / 8 1 3 october 2011 7.6 others ? the contents in this document are subject to changes , for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are qu oted for the sole purpose of reference for the use of the produ cts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. ? although sanken undertakes to enhance the qu ality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the e quipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipmen t or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where high er reliability is required (transportation equipmen t and its control syst ems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales rep resentative to discuss , prior to the use of the products herein . the use of sanken p roducts without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? in the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stress es such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self - heating of semiconductor devices. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self - heating value, the degree of derating of junction temperature (tj) affects the reliability significantly. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during trans po rtation out of sanken s distribution network . ? the contents in this document must not be transcribed or copied without sankens written consent.
|
